By encapsulating LED chips directly onto the substrate without individual plastic brackets, COB technology delivers simplified module structures, superior collision resistance during installation, and dramatically reduced long-term maintenance overhead.
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Read MoreAn honest 2026 LED industry market review detailing upstream material cost spikes, downstream project delays, irrational bidding wars, and actionable survival strategies for display manufacturers and integrators.
Read MoreComprehensive engineering breakdown for outdoor LED screen installation. Covers structural wind-load calculation, IP65 sealing, heat extraction fan layouts, and lightning surge protection.
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